Finland aims to become a European semiconductor leader, with the Tampere Region central to this effort through the Finnish Chips Competence Centre, SiPFAB pilot line, and EU Design Platform, supported by strong collaboration and a skilled workforce.
Finland has embraced the EU Chips Act with determination, building a strong national collaboration network to advance the semiconductor industry. The strategy brings together universities, corporate experts, and public actors to create a growth platform for the semiconductor business. Within this framework, the Tampere Region plays a significant role.
Mr Petri Räsänen, Director of the Chips from Tampere programme at Business Tampere, sees national collaboration as the key factor enabling rapid development in this northern country.
Räsänen said: “The Tampere region’s semiconductor expertise is built on a legacy of designing complex integrated circuits and optoelectronics. In Espoo, Kvanttinova leverages the research expertise of VTT and Aalto University, especially in materials science and silicon processing. Oulu boasts a strong history in radio technology, while in Joensuu, Photonics Finland focuses on specialised optical and photonic expertise. Each area is essential, and together, we will succeed.”
The dynamic transformation of the semiconductor sector in Tampere is evident in three parallel initiatives. Tampere University is establishing a SiPFAB pilot line for hybrid integration and packaging; the national Chips Competence Centre (FiCCC) began its operations in early 2025 with its headquarters in Tampere; and thirdly, the EU Design Platform is paving the way for Europe’s semiconductor technology leadership with strong contribution from SoCHUB.
FiCCC: Finnish Chips Competence Centre launched
FiCCC is a national and European hub for experts, connecting companies and professionals working in semiconductor technology. The competence centre is headquartered in Tampere, with access points also in Espoo, Oulu, and Joensuu.
FiCCC has secured €8m in EU funding, with the goal of supporting companies in developing their expertise and building new collaboration networks. FiCCC coordination office in Tampere has just started operations with the first employees at the beginning of January. The coordination office is a member of the consortium set up by the European Network of Chips Competence Centres (ENC).
FiCCC will focus on strengthening the European knowledge base in two interrelated competence areas where Finland has the best capacities to contribute at the European level. Those are:
- High-performance energy efficient and complex system-on-chip design.
- Specialised manufacturing and integration processes, including quantum technologies, MEMS, RF and optoelectronics, wide band gap semiconductors (SiC and GaN), ALD and MBE technologies.
SiPFAB: Focusing on the back-end of semiconductor manufacturing
Advanced packaging and chiplets play an increasingly important role in semiconductor technology and vertical applications. Tampere University’s System-in-Package pilot line will address these themes and focus on developing the final stages of semiconductor manufacturing, including integration, packaging and testing. As the back-end partner of the EU WBG pilot line, SiPFAB will integrate and test third-generation energy-efficient semiconductors and related hybrid chip systems for various end-user industries.
This €40m project and the state-of-the-art 1,300m² clean room facility will lay the foundation for research and development collaboration in advanced packaging across Europe.
Design platform enables R&D for chips startups and SMEs
In the semiconductor business, fabless companies are well-positioned to drive technological advancements and meet the needs of diverse applications. The EU design platform will provide companies with access to advanced chip design technologies via a cloud-based EDA platform and thus strengthen the EU’s chip design expertise and business.
SoC HUB from Tampere University is the Nordic partner in the €25m project developing the foundations of the Design Platform. The platform will also facilitate startups and smaller companies to venture into design with help from the upcoming Design Enablement Teams.
Why Tampere would be a real semiconductor hub
In addition to strong national and EU collaboration, Petri Räsänen highlights the availability of highly educated talent as Tampere’s advantage. This talent pool is partly thanks to Nokia’s legacy.
“Of the 8,000 chip design engineers working in the EU, over 500, or about 6%, are based in Tampere. A significant portion of Nokia’s high-end semiconductor development is located in Tampere. Alongside this, Microsoft and Nordic Semiconductors, one of Europe’s leading design service companies, also have units in Tampere. At the same time, Tampere University is strategically committed to developing the talent pipeline as the largest HEI in chip design in Finland.”
Tampere has also established a strong cluster of companies producing and applying photonic systems, III-V compound semiconductors, and laser technologies – often referred to as the ‘Laser Valley.’ Globally active companies in the cluster include Modulight, Schott, Coherent, Optofidelity, and Vexlum.
With Tampere repeatedly ranked as Finland’s most attractive city, the region’s semiconductor future looks promising. A significant demand for skilled professionals is expected in the coming years.
For more information visit: www.businesstampere.com and www.FiCCC.fi
Please note, this article will also appear in the 21st edition of our quarterly publication.
